一、基本情况

鄢义洋，男，汉族，1997年3月生，湖南常德人，工学博士，湖南大学助理教授。担任IEEE Transactions on Industrial Electronics、IEEE Transactions on Transportation Electrification等期刊审稿人，现为湖南大学电能高效高质转化全国重点实验室青年骨干。

Email：yanyiyang@hnu.edu.cn

二、教育与工作经历

2014.09-2018.06，华中科技大学，材料科学与工程学院，学士

2018.09-2021.06，华中科技大学，电气与电子工程学院，硕士（导师：康勇 教授）

2021.09-2024.12，华中科技大学，电气与电子工程学院，博士（导师：康勇 教授）

2024.12-2026.06，中国人民解放军海军工程大学，电气工程学院，讲师

2026.07-至今，湖南大学，电气与信息工程学院，助理教授（罗安院士课题组）

       三、主要研究方向与业绩

主要从事宽禁带半导体封装结构设计、封装寄生参数优化、多芯片并联均流设计、电热性能综合优化，宽禁带半导体高功率密度应用关键技术研究。以第一作者身份发表高水平论文3篇，获授权发明专利4项。

       四、代表性学术论文

[1] Y. Yan, C. Chen, Z. Wu, J. Guan, J. Lv and Y. Kang, "A High Power Density Double-Side-End Double-Sided Bonding SiC Half-Bridge Power Module," in IEEE Transactions on Transportation Electrification, vol. 9, no. 2, pp. 3149-3163, June 2023

[2] Y. Yan, B. Liu, J. Lv, Z. Zheng, J. Liu, C. Chen, Y. Kang, "A Novel Double-Sided Cooling Silicon Carbide Power Module With Ultralow Parasitic Inductance Based on an Interleaved Power Loop," in IEEE Transactions on Power Electronics, vol. 39, no. 10, pp. 12570-12588, Oct. 2024

[3] Y. Yan, J. Lv, B. Liu, Y. Zhang, J. Liu, C. Chen, Y. Kang, "Multichip Parallel Double-Sided Cooling Silicon Carbide Power Module With Low Parasitic Inductance and Balanced Dynamic Current," in IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 12, no. 5, pp. 4596-4611, Oct. 2024

[4] J. Lv, Y. Yan, J. Liu, B. Liu, Z. Zheng, C. Chen, Y. Kang, "A Dynamic Current Balancing Method for Paralleled SiC MOSFETs With Gate-Branch Full-Coupled Inductors," in IEEE Transactions on Power Electronics, vol. 39, no. 10, pp. 12600-12614, Oct. 2024

[5] J. Lv, C. Chen, Y. Yan, B. Liu, Z. Zheng and Y. Kang, "A Quantitative Analytical Model of Paralleled SiC MOSFETs for Calculating Unbalanced Switching Currents and Energy," in IEEE Transactions on Power Electronics, vol. 39, no. 12, pp. 16673-16694, Dec. 2024

[6] Z. Zheng, J. Lv, Y. Yan, J. Liu, C. Chen and Y. Kang, "A 2.5D Multichip SiC MOSFET Power Module With Low Parasitic Inductance and High Dynamic Current Sharing Performance," in IEEE Transactions on Power Electronics, vol. 40, no. 1, pp. 1542-1553, Jan. 2025

[7] Y. Xie, C. Chen, Y. Yan, Z. Huang and Y. Kang, "Investigation on Ultralow Turn-off Losses Phenomenon for SiC MOSFETs With Improved Switching Model," in IEEE Transactions on Power Electronics, vol. 36, no. 8, pp. 9382-9397, Aug. 2021

[8] Y. Yan, J. Guan, B. Liu, J. Lv, J. Liu, C. Chen, Y. Kang, "A Novel High Power Density Three Phase Traction Inverter Architecture for Electric Vehicle (EV) Applications," PCIM Europe 2024; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nürnberg, Germany, 2024, pp. 1804-1808

[9] Y. Yan, B. Liu, Y. Zhang, C. Chen and Y. Kang, "Thermal Performance Comparisons of Different Spacer Structures in Double-Sided Cooling Power Modules," 2023 IEEE Energy Conversion Congress and Exposition (ECCE), Nashville, TN, USA, 2023, pp. 5895-5899

[10] Y. Yan, Z. Wang, C. Chen, Y. Kang, Z. Yuan and F. Luo, "An Analytical SiC MOSFET Switching Behavior Model Considering Parasitic Inductance and Temperature Effect," 2020 IEEE Applied Power Electronics Conference and Exposition (APEC), New Orleans, LA, USA, 2020, pp. 2829-2833.

       五、代表性发明专利

[CP1] 陈材, 鄢义洋, 张恒, 康勇. 一种功率模块. 湖北省：CN116455180B

[CP2] 陈材, 鄢义洋, 张恒, 康勇. 一种功率模块. 湖北省： CN116387269B

[CP3] 陈材, 鄢义洋, 曾晨航, 康勇. 一种功率模块及三相电机驱动器. 湖北省：CN114725076B

[CP4] 陈材, 鄢义洋, 黄志召, 刘新民, 康勇. 一种全碳化硅双面散热模块的封装结构及其封装方法. 湖北省：CN114121907B.